Sample preparation grinding polishing machine MoPao®2B

metallographic samplemanually-operatedradius grinding

Product overview
This dual-disc benchtop metallographic sample grinding and polishing machine provides selectable rotation direction for each disc and independent grinding/polishing operation via microprocessor control. Changing metallographic abrasive papers and polishing cloths enables separate grinding and polishing processes. The unit integrates a water-cooling system to avoid specimen overheating during grinding and is designed for smooth rotation, low noise and reliable operation. It is suitable for industrial sample preparation, research laboratories and university labs.

Main technical specifications
Grinding and polishing disc diameter — φ203 mm
Polishing pad rotational speed — 0–1400 r/min (stepless speed variation)
Grinding and polishing pad steering — Adjustable clockwise and counterclockwise
Machine power — Single-phase AC 220V 50Hz
Input power — 0.75 kW
External dimensions — 755×700×310 mm
Net weight — 50 kg

Included consumables
1 — Adhesive-backed metallographic sandpaper — piece — 5 — 240#
2 — Adhesive-backed metallographic sandpaper — piece — 5 — 400#
3 — Adhesive-backed metallographic sandpaper — piece — 5 — 800#
4 — Adhesive-backed metallographic sandpaper — piece — 5 — 1200#
5 — Silk velvet with adhesive backing — piece — 3 — (no remark)
6 — Diamond suspension grinding and polishing fluid — bottle — 1 — W2.5 500 ml

Consumables summary

• Adhesive-backed metallographic sandpaper, 240#: 5 pieces
• Adhesive-backed metallographic sandpaper, 400#: 5 pieces
• Adhesive-backed metallographic sandpaper, 800#: 5 pieces
• Adhesive-backed metallographic sandpaper, 1200#: 5 pieces
• Silk velvet with adhesive backing: 3 pieces
• Diamond suspension grinding and polishing fluid W2.5 500 ml: 1 bottle

Features / Technical specifications

• Dual-disc benchtop design with selectable rotation direction for each disc
• Microprocessor control enabling independent grinding and polishing operations
• Water-cooling system to prevent specimen overheating during grinding
• Smooth rotation, compact structure, low noise and reliable safety features
• Suitable for industrial enterprises, research institutions and university laboratories for sample preparation
• Grinding and polishing disc diameter: φ203 mm
• Polishing pad rotational speed: 0–1400 r/min (stepless)
• Rotation direction: adjustable clockwise and counterclockwise
• Power supply: Single-phase AC 220V 50Hz; Input power: 0.75 kW
• External dimensions: 755×700×310 mm; Net weight: 50 kg