Ultraviolet LED array

chipcustomfor LEDs

Overview
UVC LED-based Chip-On-Board (COB) sources are component-level assemblies that package bare LED die into carrier packages to enable high-density, application-specific light engines. These COB components support scalable die counts and form factors, allowing integration of one to one thousand LED die per package. Applications include germicidal disinfection, instrumentation, and specialized industrial UV systems.

Additional information
Hybrid Chip-On-Board designs can combine UVC, visible and infrared die with sensors or mechanical elements to meet system-level requirements. Excelitas provides packaging, electrical interconnect options and guidance on thermal management, and supports design transfer from prototype to production to address integration and manufacturing constraints.

Technical features / Specifications

• Technology: UVC LED-based Chip-On-Board (COB) assemblies
• Packaging capability: bare LED die packaged into component-level carriers of any number, shape and size
• Package type: die carriers designed for electrical interconnect and thermal path optimization
• Die count per package: configurable from 1 to 1000
• Wavelengths supported: UVC (germicidal) and integration of UV-VIS-IR die
• Hybrid integration: supports combinations of UV, visible, infrared die, sensors and mechanical elements
• Applications: surface, air and water disinfection, analytical instruments, custom industrial UV systems
• Product support: standard COB package options plus customization and production transfer services