Photodiode array VTA1216H-L-NC-00-0

Photodiode array - VTA1216H-L-NC-00-0 - Excelitas Technologies - PCO
Photodiode array - VTA1216H-L-NC-00-0 - Excelitas Technologies - PCO
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Description

Product Overview
The VTA1216H-L-NC-00-0 is a 1.2 mm pitch, 16-element silicon photodiode array optimized for X-ray detection. It is offered optionally with scintillator crystals for low-energy conversion and can be integrated in single- or dual-energy detection architectures. It can be paired with the VTA1216H-H Series for high-energy detection in dual-energy systems.

Series Description
The VTA1216H Series is a 16-channel, high-resolution photodiode array (PDA). The design uses eight dual-element photodiodes mounted directly on an FR-4 printed circuit board (PCB). The standard sensor-to-sensor spacing (pitch) is 1.2 mm; other pitches are available off-the-shelf or as custom variants.

Construction & Packaging
A transparent coating protects the photosensitive chip area while a glob top encapsulant shields bond wires from mechanical and environmental damage. Devices are available with or without a scintillator mounted over the active area to convert incident X-rays into visible photons.

Key Features
  • Extremely low dark current photodiodes for improved detection sensitivity
  • High signal-to-noise ratio suitable for precision X-ray imaging
  • Optional scintillator crystals to convert X-rays to visible photons
  • 16 channels at 1.2 mm pitch for compact high-resolution arrays
  • Compatible with single- and dual-energy detection architectures

Technical specifications
  • Series: VTA1216H Series
  • Part number example: VTA1216H-L-NC-00-0
  • Number of elements / channels: 16
  • Pitch (sensor-to-sensor spacing): 1.2 mm
  • Photodiode configuration: 8 dual-element photodiodes mounted on FR-4 PCB
  • Dark current: extremely low (designed for low dark current)
  • Signal-to-noise: high
  • Scintillator: optional, mounted over active area for X-ray to visible photon conversion
  • Packaging: transparent coating over photosensitive area; glob top encapsulant protecting bond wires
  • Applications: X-ray detection, single- or dual-energy detection architectures

Catalogs

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Exhibitions

Meet this supplier at the following exhibition(s):

electronica Munich 2026
electronica Munich 2026

10-13 Nov 2026 Munich (Germany) Hall B4 - Stand 302

  • More information

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