CMOS image sensor LA

CCDUV-Vis-NIRnear-infrared

Product overview
Backside-illuminated LA Series linear image sensors deliver a miniature form factor with high quantum efficiency and ultra-fast readout for precision optical measurement systems. Designed for integration into industrial and portable platforms, they combine broad spectral response (350–1100 nm), a small chip footprint (8.1 × 1.3 × 0.23 mm) and line rates up to 257,000 lines per second.

Description
The LA Series offers high signal integrity and flexible acquisition modes (single- or multi-frame) to support accurate measurements in dynamic or low-light environments. On-chip Correlated Double Sampling (CDS) and an integrated temperature sensor simplify system calibration and ensure repeatable results. Standard I2C connectivity facilitates seamless digital integration and low-power operation for compact devices.

Specifications

• Pixel size: 7.5 μm × 120 μm
• Quantum Efficiency (QE): 350 nm to 1100 nm
• Maximum line rate: up to 257,000 lines/s
• Acquisition modes: single- or multi-frame
• Signal-to-noise ratio (SNR): 70 dB
• Built-in temperature sensor
• Miniature chip size: 8.1 × 1.3 × 0.23 mm
• Interface: Standard I2C
• On-chip Correlated Double Sampling (CDS)

Features

• High spatial resolution and measurement accuracy
• Broad spectral sensitivity for versatile optical designs
• Ultra-fast line rates for dynamic and real-time measurement
• Flexible acquisition modes for static and moving targets
• Excellent signal integrity and low measurement uncertainty
• Simple, low-power system integration
• On-chip noise reduction to improve image quality

Applications

• Precision metrology and surface scanning
• Spectroscopy and spectral analysis systems
• Linear and rotary encoders
• Distance measurement / triangulation light barriers
• Line-scan cameras and imaging encoders
• Barcode and code readers
• Multi-touch displays and electronic whiteboards
• Wearable optical sensing

Technical specifications

• Model family: LA Series
• Pixel size: 7.5 μm × 120 μm
• Spectral response / QE: 350 nm – 1100 nm
• Max line rate: up to 257,000 lines/s
• SNR: 70 dB
• On-chip features: CDS, built-in temperature sensor
• Interface: Standard I2C
• Package / chip dimensions: 8.1 × 1.3 × 0.23 mm
• Typical use cases: precision metrology, scanning, spectroscopy, wearable sensing, imaging encoders, barcode readers