Chip on carrier photodiode array VTA1616H-H-NC-00-0

Chip on carrier photodiode array - VTA1616H-H-NC-00-0 - Excelitas Technologies - PCO
Chip on carrier photodiode array - VTA1616H-H-NC-00-0 - Excelitas Technologies - PCO
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chip on carrier

Description

Product Overview
The VTA1616H-H-NC-00-0 is a silicon photodiode array (PDA) with 16 single-element channels at a 1.6 mm pitch, optimized for X-ray detection. It is available optionally with scintillator crystals for high-energy detection and can be combined with the VTA1616H-L series in dual-energy system architectures.

Series Description
The VTA1616H series provides a high-resolution 16-channel photodiode array with individual photodiodes mounted directly on an FR-4 printed circuit board. The standard sensor-to-sensor spacing is 1.6 mm; other pitches can be supplied as standard options or manufactured to customer specifications.

Construction and Options
The assembly is encapsulated in an X-ray radiation-hard, optically transparent molding compound to protect the diodes and electronics. Devices can be supplied with or without a scintillator mounted over the photodiode active area to convert incident X-rays into visible photons.

Applications
Designed for integration in X-ray detection systems, including single- and dual-energy imaging and inspection systems. Suitable for medical imaging, security scanners and industrial non-destructive testing when paired appropriately within system architectures.

Key Features
  • 16 channels at 1.6 mm pitch
  • Silicon photodiodes with very low dark current
  • High signal-to-noise ratio
  • Optional scintillator crystals for X-ray to visible photon conversion
  • Compatible with single- and dual-energy system configurations; pairs with VTA1616H-L for low-energy detection

Technical specifications
  • Series: VTA1616H Series
  • Number of elements: 16 single-element photodiodes
  • Pitch (sensor-to-sensor spacing): 1.6 mm (standard; other pitches available)
  • Mounting: Photodiodes mounted directly on FR-4 PCB
  • Encapsulant: Molded, X-ray radiation-hard, optically transparent material
  • Scintillator: Optional, mounted over active area to convert X-rays into visible photons
  • Application: X-ray detection; suitable for single- or dual-energy detection architectures

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Exhibitions

Meet this supplier at the following exhibition(s):

electronica Munich 2026
electronica Munich 2026

10-13 Nov 2026 Munich (Germany) Hall B4 - Stand 302

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